Opto-Electronics Packaging Die Bonding Machine with 0.5μ M

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: High Speed
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Precision: High Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Equipment Applications: Coc, COB, Gold Box, Cow, Cos
• Weights: 2200kg
• Nozzle: 12 Nozzles Per Head, with Dynamic Tool Change
• Working Table: 2
• Transfer Table: up to 8 Working Tables (Per Machine)
• Temperature Range: up to 500°c (Maximum)
• Temperature Rising Rate: 50°c/S (Maximum)
• Transport Package: Wooden Crates and Vacuum Wooden
• Specification: 1900mm*1100mm*1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 1900.00cm * 1100.00cm * 1800.00cm
• Package Gross Weight: 2100.000kg

Product Description

 

Product Description

The EG9922 provides flexible and diverse packaging capabilities for advanced packaging.

Detailed Photos

1. High Precision: ±0.5µm@3σ, high-precision closed-loop force control
2. More comprehensive: Laser heating,suitable for complex surfaces,with a spot- size that can reach the micron level
3. High Flexibility: Multiple suction nozzles for automatic replacement, rail-to-rail loading and unloading
4. Easy to Expand: Handling of small chips,support for minimum sizes down to 100 μm

 

Product Parameters

 

Product model		EG9922
Placement accuracy		±0.5µm@3σ
Placement angle		±0.1°
Placement process		Eutectic, adhesive dipping
Equipment application		COC,COB,Gold Box,COW,COS
Efficiency		25 seconds/chip (eutectic)
		5~7 seconds/chip (adhesive dipping)
Placement module	Nozzle	12 nozzles per head, with dynamic toolchange
	Force control	(10~50g)±2g,(50~300g)±3%
Transfer module.	Nozzle	2 nozzles per head, with dynamic toolchange
	Force control	(10~50g)±2g,(50~300g)±3%
Eutectic module	Working table	1
	Transfer table	Up to 8 working tables (per machine)
	Heating method	Pulse heating
	Temperaturerange.	500°C(highest)
	Temperaturerising rate	50°C/S(maximum)
Feeding mode	Wafer	6-inch, up to 2 wafers supported
	Waffle Pack Gel-Pak	2-inch, up to 2supported
Dimensions (length x width x height)		1900mm×1100mm×1800mm
Weight		2200kg (max)
Compressed air		0.4~0.7MPa
Nitrogen gas		0.4~0.7MPa
Environmental temperature		23±2°C

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.