Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine China Factory

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: High Speed
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: EH9721
• Precision: High Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Equipment Applications: Coc.COB.Gold-Box.Cow.Cos
• Weights: 2000kg
• Nozzle: 12 Nozzles Per Single Head, Dynamic Tool Change
• Force Control: 1
• Workbench: 1
• Transfer Station: 8 (Maximum) on a Single Workbench
• Temperature Range: up to 500°c (Maximum)
• Temperature Ramp Rate: up to 50°c/S (Maximum)
• Transport Package: Wooden Crates and Vacuum Wooden Crates
• Specification: 1650mm*1100mm*1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 1160.00cm * 1225.00cm * 1800.00cm
• Package Gross Weight: 2000.000kg

Product Description

 

Product Description

The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products.

Detailed Photos

1. High Precision: ±2µm@3σ
2. High Efficiency: Multiple workstations, fast and accurate temperature and force control
3. High Flexibility: Multiple suction nozzles for automatic replacement, multiple intermediate stations for free switching, various feeding methods for flexible selection, rail-to-rail loading and unloading
4. Easy to Expand: Cooperating with customers for process exploration, customizable development, and optional functional modules including Flip Chip.

 

Product Parameters

 

 

 

Product model		EH9721
Placement Accuracy		±2µm@3σ
Placement Angel		±0.3°
Placement Process		Eutectic, Underfill, Flip Chip (optional)
Equipment Application		COC,COB,Gold Box,COW,COS
Efficiency		15~25 seconds per piece (Eutectic)
		5~7 seconds per piece (Adhesive dipping)
Surface MountTechnology (SMT)module	Nozzle	12 nozzles per single head, dynamictool change
	Force Control	(10~50g)±2g,(50~300g)±3%
Transfer Module	Nozzle	/
	Force Control	/
Eutectic Module	Workbench	1
	Transfer Station	8 (maximum) on a single workbench
	Heating method	Pulse heating
	TemperatureRange	500°C(highest)
	TemperatureRamp Rate	50°C/S(maximum)
Feeding Mode	Wafer	6 inches, supports up to 2pieces
	Waffle Pack Gel-Pak	2 inches,supports up to 9 pieces
Overall dimensions (length × wide × High)		1650mm×1100mm×1800mm
Weight		2000Kg(maximum)
Compressed air		0.4~0.7MPa
Nitrogen gas		0.4~0.7MPa
Ambient temperature		23±2°C

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.