After-sales Service: | 7*24 Hour After-Sales Service |
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Condition: | New |
Speed: | High Speed |
Shipping Cost:
Estimated freight per unit. |
about shipping cost and estimated delivery time. |
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Payment Method: | |
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Initial Payment Full Payment |
Currency: | US$ |
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Return&refunds: | You can apply for a refund up to 30 days after receipt of the products. |
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The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.
The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products.
Product model |
EH9721 |
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Placement accuracy |
±3µm@3σ |
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Placement angle | ±0.3° | |
Placement process |
Eutectic, adhesive dipping |
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Equipment application |
COC,COB,Gold Box,COW,COS |
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Efficiency
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15~25 seconds/chip (eutectic) |
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5~7 seconds/chip (adhesive dipping) |
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Placement module |
Nozzle |
12 nozzles per head, with dynamic toolchange |
Force control. |
(10~50g)±2g,(50~300g)±3% |
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Transfer module. |
Nozzle |
2 nozzles per head, with dynamic toolchange |
Force control. |
(10~50g)±2g,(50~300g)±3% |
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Eutectic module |
Working table |
2 |
Transfer table |
Up to 8 working tables (per machine) |
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Heating method |
Pulse heating |
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Temperaturerange. |
500°C(highest) |
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Temperaturerising rate |
50°C/S(maximum) |
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Feeding mode |
Wafer |
6-inch, up to 2 wafers supported |
Waffle Pack Gel-Pak |
2-inch, up to 2supported |
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Dimensions (length x width x height) |
1900mm×1100mm×1800mm |
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Weight |
2200kg (max) |
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Compressed air |
0.4~0.7MPa |
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Nitrogen gas |
0.4~0.7MPa |
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Environmental temperature |
23±2°C |
Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.
1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.
2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.
3.What is the minimum order quantity for the product?
1 set.
4.How long does it take to ship an order?
Within 100 days of signing the contract
5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.
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