Flip Chip Package Die Bonding Machine

FOB Price: US$100,000.00-300,000.00 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US$100,000.00-300,000.00
Port: Shanghai, China
Transport Package: Wooden Crates and Vacuum Wooden Crates
Payment Terms: T/T

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Product Description

Company Info

Address: No. 666, Huxin West Road, Wujiang District, Suzhou, Jiangsu, China
Business Type: Manufacturer/Factory
Business Range: Consumer Electronics, Industrial Equipment & Components, Manufacturing & Processing Machinery
Management System Certification: ISO 9001
Company Introduction: Established in 2001, Bozhon Precision Technology Co., Ltd (stock code: 688097) has built R&D centers and production bases of 400, 000 square meters, focusing on the field of industrial equipment manufacturing. The business focuses on consumer electronics, digital new energy, high-end equipment, semiconductors, key components, intelligent warehousing and logistics, and other digital equipment.

Suzhou Bozhon Semiconductor Co., Ltd. is a semiconductor subsidiary of Bozhong Precision Industry. It is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise, the company is dedicated to providing customers with leading and stable advanced process and inspection equipment in the semiconductor industry.

Suzhou Bozhon Semiconductor is committed to becoming a leader in the Chinese semiconductor industry, promoting the development of advanced processes and industrial upgrades in the semiconductor industry through R&D and product innovation in micrometer, sub-micrometer, and nanometer-level technologies, and continuously providing cutting-edge products to the industry.

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Last Login Date: Oct 25, 2024

Business Type: Manufacturer/Factory

Main Products: Fully Automatic High Precision Soldering Machine, Aoi Inspection Machine, High-Speed High-Precision Die Bonder

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