Laser Heating Is Suitable for High-Precision Eutectic Machines with Complex Surfaces

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: High Speed
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: EG9921
• Precision: High Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Binding Force: 10~7,500 G (Programmable)
• Uph: 7000(Max)
• X/Y Placement Accuracy: ± 7µm @ 3σ
• Theta Placement Accuracy: ±0.15°@ 3σ
• Bonding Head Heatingtemperatur: up to 350 °c (Optional)
• Transport Package: Wooden Crates and Vacuum Wooden Crates
• Specification: 1160mm*1225mm*1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 190.00cm * 110.00cm * 180.00cm
• Package Gross Weight: 2200.000kg

Product Description

 

Product Description

The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy of ±7@3σ microns and can achieve an ultimate bonding efficiency of up to 7000 pieces per hour (depending on the process). The DU9721 series adopts an open architecture and modular design, providing customers with on-demand customization capabilities for maximum efficiency. It integrates various functional modules

such as dispensing, automatic tool changing, and hot-press bonding, and can handle multiple wafer sizes and substrate transfer methods to meet various packaging technologies, including die bonding, MCM, flip chip, SiP, etc.

Detailed Photos

1. Ultimate Efficiency: Meets high-precision die bonding accuracy of ±7 microns @ 3σ and achieves an ultimate bonding efficiency of up to 12,000 pieces per hour (depending on the process).
2. Multi-functionality: Die bonder, flip chip bonder, and multi-chip packaging in one machine.
3. Flexibility: Supports wafer, waffle pack, gel pack, and feeder feeding; Supports die bonding on substrate, boat, carrier, PCB, leadframe, and wafer; Supports epoxy, soldering, and hot-press bonding; Supports packaging technologies including Die attach, MCM, Flip chip, and SiP.
4. Customizable: Modular design combined with standardized platform design concept, releasing a new product line every 6 months; compatible with different categories of development needs, supports multiple feeding methods, and can be customized production lines according to customer requirements.

 

Product Parameters

Product model	DU9721
X/Y Placement Accuracy	± 7µm @ 3σ
Theta Placement Accuracy	±0.15°@ 3σ
Bonding Head HeatingTemperature	Up to 350 °C (optional)
Binding force	10~7,500 g (programmable)
Rotation range	0°- 360° rotation
Wafer size	4" - 12" (100mm - 300mm)
DieSize(Bonded)	Die Attach: 5mm,5mm - 50mm
Die Size (Flip-Chip)	Flip Chip: 0.5mm - 5mm,5mm-50mm
Die Thickness	0.05mm - 7mm
Frame Size	5" - 15" (125mm - 375mm)
Wafer Carrier	Waffle pack / Gel-Pak® 2"×2" and 4"×4"/JEDEC tray
Substrate type	FR4, ceramic, BGA, flex, boat, lead frame, waffle pack,Gel-Pak®,JEDEC tray, odd-shape substrates
Substrate range	13"× 8"(325mm× 200mm)
UPH	7000(max)
Equipment Dimensions	1,160mm×1,225mm×1,800mm

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.