High Precision Soldering Machine Die Bonding

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: Medium Speed
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: EF7921
• Precision: High Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Manual
• Type: Medium-speed Chip Mounter
• Equipment Application: Coc,COB,Gold Box,Cow,Cos
• Nozzle: 12 Nozzles Per Single Head, Dynamictool Change
• Workbench: 1
• Transfer Station: 8 (Max) on a Single Workbench
• Wafer: 6 Inch, Supports up to 4 Piece
• Waffle Pack Gel-Pak: 2 Inch, Quantity Can Be Customiza
• Weight: 2200kg(Max)
• Transport Package: Wooden Crates and Vacuum Wooden Crates
• Specification: 1900mm× 1100mm× 1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 1900.00cm * 1100.00cm * 1800.00cm
• Package Gross Weight: 3000.000kg

Product Description

 

Product Description

The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.
The EF7921 is a manual process platform with sub-micron mounting accuracy.

Detailed Photos

Product Features
1.High Precision: Sub-micron mounting accuracy;
2.High Flexibility: Different modules can be selected for different application industries;
3.Real-time Feedback: Closed-loop force control; High-definition process observation.

 

Product Parameters

Product model		EF7921
Placement accuracy		±0.5µm@3σ
Placement angle		±0.1°
Placement process		Eutectic, Underfill,Flip Chip(optional)
Equipment Application		COC,COB,Gold Box,COW,COS
Efficiency		25 seconds per piece (Eutectic)
		5~7 seconds per piece (Adhesive dipping)
Surface MountTechnology (SMT)module	Nozzle	dynamictool change
	Force Control	closed loop force control during fitting process
Transfer Module	Nozzle	12 nozzles per single head, dynamictool change
	Force Control	(10~50g)±2g,(50~300g)±3%
Eutectic Module	Workbench	1
	Transfer Station	8 (max) on a single workbench
	Heating method	Laser Heating
	TemperatureRange	2000°C(max)
	Temperature rise rate	400°C/S(max)
Feeding Mode	Wafer	6 inch, supports up to 4 pieces
	Waffle Pack Gel-Pak	2 inch, quantity can be customizad
Overall Dimension (Length x Width xHeight)		1900mm×1100mm×1800mm
Weight		2200Kg(max)
Compressed air		0.4~0.7MPa
Nitrogen gas		0.4~0.7MPa
Ambient temperature		23±2°C

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.