After-sales Service: | 7*24 Hour After-Sales Service |
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Condition: | New |
Speed: | High Speed |
Shipping Cost:
Estimated freight per unit. |
about shipping cost and estimated delivery time. |
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Payment Method: | |
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Initial Payment Full Payment |
Currency: | US$ |
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Return&refunds: | You can apply for a refund up to 30 days after receipt of the products. |
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The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.
5G and Data Communications, Lasers, High-precision MEMS, Medical and
Bio-Optics, Automotive, LEDs, Optics, Power Semiconductors,RF,Microwave
and Antennas, Sensors, Telecommunications.
Product model |
EH9721 |
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Placement accuracy |
±3µm@3σ |
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Placement angle | ±0.3° | |
Placement process |
Eutectic, adhesive dipping |
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Equipment application |
COC,COB,Gold Box,COW,COS |
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Efficiency
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15~25 seconds/chip (eutectic) |
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5~7 seconds/chip (adhesive dipping) |
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Placement module |
Nozzle |
12 nozzles per head, with dynamic toolchange |
Force control. |
(10~50g)±2g,(50~300g)±3% |
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Transfer module. |
Nozzle |
2 nozzles per head, with dynamic toolchange |
Force control. |
(10~50g)±2g,(50~300g)±3% |
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Eutectic module |
Working table |
2 |
Transfer table |
Up to 8 working tables (per machine) |
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Heating method |
Pulse heating |
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Temperaturerange. |
500°C(highest) |
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Temperaturerising rate |
50°C/S(maximum) |
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Feeding mode |
Wafer |
6-inch, up to 2 wafers supported |
Waffle Pack Gel-Pak |
2-inch, up to 2supported |
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Dimensions (length x width x height) |
1900mm×1100mm×1800mm |
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Weight |
2200kg (max) |
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Compressed air |
0.4~0.7MPa |
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Nitrogen gas |
0.4~0.7MPa |
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Environmental temperature |
23±2°C |
1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.
2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.
3.What is the minimum order quantity for the product?
1 set.
4.How long does it take to ship an order?
Within 100 days of signing the contract
5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.
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