Appearance Aoi Optical Detection Equipment Is Compatible with Multiple Chip Packaging Forms

• After-sales Service: 7*24 Hour After-Sales Service
• Application: Health & Medicine
• Input&Output Media: Tray to Tray
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: IR9821
• Low Ball Inspection(20μm): Avaliable
• Dent/Bulge Inspection: Avaliable(Bottom Only
• 2D Code Reading: Avaliable
• Ocr: Avaliable
• Uph: 2500 (Pkg35X35 BGA) 11K (Pkg5*5 Qfn 5s) 21K (Pkg5*
• Min Defect: 30um
• Transport Package: Wooden Crates and Vacuum Wooden
• Specification: 2000*1650*1400
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 190.00cm * 170.00cm * 180.00cm
• Package Gross Weight: 2800.000kg

Product Description

 

Product Description

The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final package quality.

Detailed Photos

Accurate 3D Metrology:
Accuracy/Repeatability:5um/5um @3σ;
Minimum Ball Size: 100um;
3D scan of surface to detect and measure dents, bulges;

High flexible:
Advanced Inspection of any Object: BGA,QFN,LGA,QFP,SOP, etc;
Device Size: 3*3mm-58*58mm

4 Inspection Stations:
Equipped with Top 3D station;

Advanced Defect Classification:
Intelligent Defect Classification;
3 NG Buffer;

 

Product Parameters

 

Machine Model		IR9821
Input&Output Media		Tray to Tray
Device Size		3x3mm~120x120mm
Minimum Ball Size		100μm
Surface defect capability		30x30um
3D rep/acc		5μm
Low Ball Inspection(20μm)		Avaliable
Dent/Bulge Inspection		Avaliable(Bottom only)
Sorting		1x4 Head
Color Camera(Option)		Avaliable
Component Height Measurement(Option)		Avaliable
2D Code Reading		Avaliable
OCR		Avaliable
Crack Inspection		10μm width
UPH		2500 (PKG35X35 BGA) 11K (PKG5*5 QFN 5S) 21K (PKG5*5 QFN)

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.