High Speed and Precision Equipment for High Binding Force Applications

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: Medium Speed
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: DU9821
• Precision: High Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Placement Process: Eutectic, Underfill
• Equipment Application: Coc,COB,Gold Box,Cow,Cos
• Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan
• Workbench: 2
• Wafer: 6 Inch, Supports up to 4 Piece
• Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces
• Transport Package: Wooden Crates and Vacuum Wooden Crates
• Specification: 1900mm*1100mm*1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 165.00cm * 122.00cm * 180.00cm
• Package Gross Weight: 2200.000kg

Product Description

 

Product Description

The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips.

Detailed Photos

1. High Precision: ±3µm@3σ, giving customers leading product yields
2. High Efficiency: Multiple workstations, fast and accurate temperature and force control, providing over 20% output improvement under specific conditions
3. High Flexibility: Multiple suction nozzles for automatic replacement, multiple intermediate stations for free switching, various feeding methods for flexible selection, 4-wafer feeding system, and dynamic needle changing system
4. Easy to Expand: Proprietary customer programming interface (BOS), customizable development, and optional functional modules including Flip Chip.

 

Product Parameters

Product model		EH9721
Placement accuracy		±3µm@3σ
Placement angle		±0.3°
Placement process		Eutectic, Underfill
Equipment Application		COC,COB,Gold Box,COW,COS
Efficiency		15~25 seconds per piece (Eutectic)
		5~7 seconds per piece (Adhesive dipping)
Surface MountTechnology (SMT)module	Nozzle	12 nozzles per single head, dynamictool change
	Force Control	(10~50g)±2g,(50~300g)±3%
Transfer Module	Nozzle	12 nozzles per single head, dynamictool change
	Force Control	(10~50g)±2g,(50~300g)±3%
Eutectic Module	Workbench	2
	Transfer Station	8 (max) on a single workbench
	Heating method	Pulse Heating
	TemperatureRange	500°C(max)
	Temperature rise rate	50°C/S(max)
Feeding Mode	Wafer	6 inch, supports up to 4 pieces
	Waffle Pack Gel-Pak	2 inch, supports up to 2 pieces
Overall Dimension (Length x Width xHeight)		1900mm×1100mm×1800mm
Weight		2200Kg(max)
Compressed air		0.4~0.7MPa
Nitrogen gas		0.4~0.7MPa
Ambient temperature		23±2°C

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.