Used High Quality Speedline Micron Level Epoxy Die Bonding /Attach Machine

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: High Speed
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: FastStar Series-DW9621
• Precision: High Precision
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Binding Force: 500 N (Max)
• Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable)
• Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe
• Uph: up to 10,000 Pieces Per Hour (Max)
• Transport Package: Wooden Crates and Vacuum Wooden Crates
• Specification: 1160mm*1225mm*1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: Drug Solution
• Package Size: 1160.00cm * 1225.00cm * 1800.00cm
• Package Gross Weight: 3000.000kg

Product Description

 

Product Description

The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an accuracy of ±10 microns and an ultimate bonding force of up to 500N and an ultimate bonding efficiency of up to 10,000 pieces per hour (depending on the process). The DW9621 series adopts an open architecture and modular design, providing customers with on-demand customization capabilities for maximum efficiency. It integrates various functional modules such as dispensing, automatic tool changing, and hot-press bonding, and can handle multiple wafer sizes and substrate transfer methods to meet various packaging technologies, including power module,IGBT, SiC, MCM, SiP, etc.

Detailed Photos

1. High bonding force: Achieves a bonding force of up to 500N with a self-developed force control system.
2. High efficiency: Meets high-precision die bonding accuracy of ±10 microns and achieves an ultimate bonding efficiency of up to 10,000 pieces per hour (depending on the process).
3. Supports sintering process: Sintering film treatment, sintering paste distribution, pre-coated sintering paste.

Bonding head heating temperature of 450ºC, substrate heating temperature of 300ºC.

1. Customizable open platform: Modular design combined with standardized platform design concept, releasing a new product line every 6 months; compatible with different categories of development needs, supports multiple feeding methods, and can be customized production lines according to customer requirements.

 

Product Parameters

 

 

Product model	DW9621
X/Y Placement Accuracy	±10µm @ 3σ
Theta Placement Accuracy	±0.15°@ 3σ
heating temperature	Up to 350°C (optional)
binding force	500 N (max)
rotation angle	0°- 360° rotation
wafer size	Wafer size: 8" - 12" (4", 6" customizable)
chip/component size	0.8mm - 15mm (customizable according to requirements)
chip thickness	0.05mm - 7mm(die attach)
frame size	5" - 15" (125mm - 375mm)
feeding method	Waffle pack/Gel-Pak®2" x×2" and 4" ×4"/JEDEC tray
substrate type	FR4, ceramic, flex, boat, 8"/12" wafers, other
UPH	Up to 10,000 pieces per hour (max)
Equipment Dimensions	1160mm×1225mm×1800mm

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.