Photonics Packaging Die Bonding Machine

• After-sales Service: 7*24 Hour After-Sales Service
• Condition: New
• Speed: High Efficiency
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: EG9921
• Precision: High Precision
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Surface Mount Technology(SMT) Module: Eutectic, DIP Bonding, Flip Chip (Optional), Heati
• Equipment Application: Aoc/Vcsel/Multi Mode/Lidarlaser Bar and Mems Assem
• Efficiency: 25 Seconds/Piece (Eutectic, Actual Production May
• Force Control: Closed-Loop Force Control During Bonding Process
• Heating Method: Laser Heating
• Transport Package: Wooden Crates and Vacuum Wooden Crates
• Specification: 1900mm*1100mm*1800mm
• Trademark: Suzhou Bozhon Semiconductor Co
• Origin: China
• Package Size: 2000.00cm * 2500.00cm * 2000.00cm
• Package Gross Weight: 2100.000kg

Product Description

 

Product Description

The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and rapid cooling. It can also use a pulse heating module designed specifically for multi-chip soldering.

Detailed Photos

1. High Precision: Accuracy of ±0.5μm@3σ, high-precision closed-loop force control;
2. More Comprehensive: Laser heating, suitable for complex surfaces, with a spot size that can reach the micron level, and can adapt to heating of small devices;
3. Easy to Expand: Handling of small chips, support for minimum sizes down to 100μm, and inspection and correction of mounting position and accuracy.

 

Product Parameters

Product Model	EG9921
Placement Accuracy	±0.5μm@3σ
Surface Mount Technology(SMT) module	Eutectic, dip bonding, Flip Chip (optional), heating method(optional)
Equipment application	AOC/VCSEL/Multi Mode/LidarLaser Bar and MEMS assemblySemiconductor advanced packaging
Efficiency	25 seconds/piece (eutectic, actual production may varydepending on specific conditions)
Force Control	Closed-loop force control during bonding process
Heating method	Laser Heating
Compressed air	0.4~0.7MPa
Nitrogen gas	0.4~0.7MPa
Ambient temperature	25±2°C

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.

 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.